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What is the right cooling solution for a data center
with rising rack densities?

Four pressures are closing in on critical-facilities teams at the same time.
The usual answer is to bet on one cooling approach, or rip out what you have and start over.

 

Both leave you exposed.

Rack densification

Rack densities are rising faster than the cooling that it was designed for them.

Variable cooling
demands

IT Loads fluctuate from rack to rack and hour by hour. Fixed cooling systems cannot adapt to these dynamic changes

Unknown future
requirements

You have to plan for densities
you cannot yet predict.

Lower PUE targets

Efficiency goals keep
tightening while heat loads
keep rising.

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Cooling at each rack, exactly when and where it is needed.

PodLogic responds to server load as it swings, and cools pods where racks of different densities sit side by side. You match the right cooling to each rack, not the whole room to its hottest rack.

 

PodLogic is an intelligent thermal management platform that unifies the control and monitoring of multiple cooling technologies within a single pod. The PodLogic controller integrates across multiple cooling technologies at the pod level, in one interface. It is technology-agnostic, and it works inside the facility you already have, with no rip-and-replace.

ENERGY EFFICIENCY

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SCALABILITY

SPACE OPTIMIZATION

CONFIGURABLE PLATFORM

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The PodLogic product line

Each technology stands on its own and integrates with the PodLogic Controller.

UFRC replaces fan wall system and CRAH units
with local modular cooling under each rack, virtually linked for pod-level control, modulating cold air exactly to match rack demand.

Under-rack placement · Pod-level virtual linking · No raised-floor plenum required.

Liquid-cooling designed to deliver efficient and safe TC water to racks, offering the highest-density cooling option within the PodLogic Platform.

Direct-to-chip liquid cooling · FWS-powered CDU drives the TCS loop · Integrated enclosure with removable panels and doors.

Integrated fans move exhaust from the hot aisle · Cold air delivered into containment · 

Add close-coupled cooling to mid-density rows without re-architecting the hall. IRC sits in the row for hot or cold aisle containment, close-coupled to the racks it serves.

Deliver localized and energy-efficient cooling in data centers. Designed for HPC and warm-water cooling, it allows free cooling under certain ambient temperatures.

Complete rear-door retrofit for existing racks · chilled water heat exchanger cools exhaust before room return.

The right cooling for every rack, from air to liquid

How much cooling does each PodLogic product deliver?
Match the technology to the density, and step a rack up the continuum as its load climbs.

One platform spans the whole density continuum, a marketed range of 25, 40, 65, and 800 kW per rack. Capacities are shown as maximums.

PRODUCT

TECHNOLOGY

CAPACITY / RACK

BEST FIT

UFRC

Underfloor rack cooling (air)

UP TO 25 kW

Low to mid-density air-cooled racks

IRC

In-row chilled-water cooling

UP TO 40 kW

Hot or cold aisle containment

RDHx

Rear-door heat exchanger

UP TO 65 kW

High density air-cooled racks

CDU

Coolant distribution unit (direct-to-chip liquid cooling)

UP TO 800 kW

Highest-density HPC and GPU racks

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What the platform delivers

15%

UP TO

total energy savings vs. CRAH

15%

UP TO

more leasable square feet in the same footprint

IES Prototype study: where the energy savings come from

810 MWh

fan-energy reduction (40%)

45 MWh

pump energy (16%)

374 MWh

chiller energy (7%)

24 MWh

heat rejection (7%)

Bring us your next data hall

Send us the shape of the project, and we will review the opportunity, show how the PodLogic platform maps to your floor, and propose a layout. No hard sell, just a plan you can take to your team.
 

Four quick questions to get us started:
 

  • Total capacity you are planning, in kW

  • How many racks

  • Rack density, in kW per rack

  • Whether you have the data hall layout

Do you have the data hall layout?
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PodLogic data center cooling, answered

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